发明名称 |
ALUMINUM ELECTROPLATING METHOD |
摘要 |
<p>The present invention forms an aluminum plating layer to be capable of anodizing after aluminum is coated on magnesium or a magnesium alloy. According to the present invention, the method for forming an aluminum plating layer prevents a reaction between an electrolyte and a base material when an aluminum plating layer is formed to suggest a technique underlayer-plating to improve interface bonding strength of the aluminum plating layer and the base material and a formation condition of the aluminum plating layer which can be anodized on the base material.</p> |
申请公布号 |
KR20150079368(A) |
申请公布日期 |
2015.07.08 |
申请号 |
KR20140051775 |
申请日期 |
2014.04.29 |
申请人 |
THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) |
发明人 |
LEE, JONG HYEON;YOO, BUNG UK |
分类号 |
C25D11/04;C25D5/10;C25D11/30 |
主分类号 |
C25D11/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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