发明名称 ALUMINUM ELECTROPLATING METHOD
摘要 <p>The present invention forms an aluminum plating layer to be capable of anodizing after aluminum is coated on magnesium or a magnesium alloy. According to the present invention, the method for forming an aluminum plating layer prevents a reaction between an electrolyte and a base material when an aluminum plating layer is formed to suggest a technique underlayer-plating to improve interface bonding strength of the aluminum plating layer and the base material and a formation condition of the aluminum plating layer which can be anodized on the base material.</p>
申请公布号 KR20150079368(A) 申请公布日期 2015.07.08
申请号 KR20140051775 申请日期 2014.04.29
申请人 THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) 发明人 LEE, JONG HYEON;YOO, BUNG UK
分类号 C25D11/04;C25D5/10;C25D11/30 主分类号 C25D11/04
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