| 摘要 |
<p>Provided are an apparatus and a method for treating a substrate by heat. The apparatus for treating a substrate comprises: a heating plate having a plurality of heating zones on an upper surface, and where the substrate is settled; a heater located in the heating plate to heat each heating zone; a measurement member measuring the temperature of each heating zone; and a controller receiving a temperature value measured from the measurement member and deciding a settlement condition of the substrate. The measurement member face the heating plate around a central axis, and comprises temperature sensors having a first sensor and a second sensor measuring the different temperature of heating zones. The controller decides the settlement condition of the substrate based on a first difference value between a first temperature value provided from the first sensor, and a second temperature value provided from the second sensor. Also, the controller separates the normal settlement condition about a central area and an edge area of the substrate and decides the same, thereby precisely understanding the settlement condition about the substrate in which one surface is round.</p> |
