APPARATUS FOR CHAMFERING GLASS SUBSTRATE AND LASER PROCESSING APPARATUS

摘要

The present invention is provided to chamfer an inner circumferential side of an opening or the like of a glass substrate having an opening. A method for chamfering a glass substrate of the present invention is used to chamfer a cross-section of the substrate by irradiating the glass substrate with a laser beam. The method includes: a first process of irradiating the glass substrate with a laser beam which is a mid-infrared ray and is absorbed into a peripheral side of a first main surface of an end portion of the glass substrate, a first main surface and the inside of the glass substrate; a second process of chamfering the glass substrate by scanning an end portion of the glass substrate with a laser beam and melting edges of the peripheral side of the first main surface and a second main surface, opposite to the first main surface, of the glass substrate.