PROTECTIVE LAYER OF HYBRID ELECTRIC MODULE APPLIED FOR BARE DIE

摘要

Disclosed is a protective layer of a hybrid electronic and electrical module applied with a bare die. The protective layer of the hybrid electronic and electrical module applied with the bare die according to one embodiment of the present invention includes a plurality of electronic and electrical devices mounted on the upper side of a substrate which is arranged on the lower side of the inside of a case. The protective layer is formed on the upper side of the electronic and electrical devices and includes at least one layer which is made of a material selected among Al_2O_3, AlN, SiOx, and SiNx.