| 摘要 |
A sensor device comprises a sensor die, a second substrate, and a conductive assembly. The sensor die comprises a first substrate having a front surface and a back surface; a sensor located on the front surface or in the front surface; bond pads located on the front surface or in the front surface, and electrically connected to the sensor; and multiple opening extended to one among the bond pads from the back respectively. The second substrate has an upper surface and a lower surface, and the lower surface of the second substrate is mounted on the upper surface of the first substrate. The conductive assembly is electrically connected to at least one portion among the bond pads through at least one portion among the openings. |
