Integrated circuit package with stand-off legs

摘要

Provided is a lead frame package with stand-off legs to prevent the die attach pad (DAP), which is part of the package substrate, to tilt or shift from its original position during the molding process. Also provided are methods for assembling such lead frame packages into various integrated circuit (IC) packages. Compared to conventional lead frame packages without stand-off legs, the lead frame packages of the present invention have less aesthetic and functional defects, thereby leading to an increase in product reliability and yield.

主权项

1. An integrated circuit (IC) package comprising:
a package substrate including a die attach pad (DAP) and a plurality of lead fingers arranged around the DAP; a die mounted on the DAP; a plurality of stand-off legs connected to the DAP; and a mold compound covering the die, at least a portion of the package substrate, and at least a portion of the plurality of stand-off legs, wherein portions of the DAP directly above the plurality of stand-off legs have flat surfaces, further wherein the mold compound covers bottom surfaces of the plurality of stand-off legs, wherein each stand-off leg is coupled at one end to a bottom surface of the DAP and at the other end to a floor of the mold compound, further wherein a vertical height of each stand-off leg is substantially equal to a vertical height between the DAP and the floor of the mold compound, and further wherein the bottom surfaces of the plurality of stand-off legs are flat, and wherein the plurality of stand-off legs includes at least two stand-off legs connected to a first side of the DAP and at least two stand-off legs connected to a second side of the DAP.