发明名称 |
Image capturing module and image sensing unit thereof |
摘要 |
An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability. The optical auxiliary unit includes a housing frame and a movable lens assembly. The housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame. |
申请公布号 |
US9077880(B2) |
申请公布日期 |
2015.07.07 |
申请号 |
US201314028671 |
申请日期 |
2013.09.17 |
申请人 |
LITE-ON TECHNOLOGY CORPORATION |
发明人 |
Ferraris Charles Ian Daduya |
分类号 |
H04N5/225;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
Li & Cai Intellectual Property (USA) Office |
代理人 |
Li & Cai Intellectual Property (USA) Office |
主权项 |
1. An image capturing module, comprising:
an image sensing unit including a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability; an optical auxiliary unit including a housing frame and a movable lens assembly, wherein the housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame; a plurality of conductive lines disposed on the microlens array substrate; and at least one electronic component disposed on the microlens array substrate and electrically connected to the conductive lines; wherein the at least one electronic component is electrically connected to the image sensing chip through the corresponding conductive line and one of an anisotropic conductive film and an anisotropic conductive adhesive in sequence. |
地址 |
Taipei TW |