Passive probing of various locations in a wireless enabled integrated circuit (IC)

摘要

Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

主权项

1. A wireless integrated circuit testing environment, comprising:
a coupling element configured to proximity couple to a second coupling element within an integrated circuit to passively observe a signal passing through the second coupling element, the integrated circuit being located within a semiconductor wafer; and wireless automatic test equipment configured to determine a signal metric of the signal as observed by the coupling element and to compare the signal metric with a plurality of predetermined signal metrics to determine a location of the integrated circuit within the semiconductor wafer.