| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress damage in a circuit board and an electronic circuit, the damage being caused in injection molding of an outer case.SOLUTION: In an electronic circuit unit 1, a mold exclusion part 10A having a back surface side covered by a molded resin and a front surface side exposed from an outer case 20 made from the molded resin is provided at a part of a plate surface of a circuit board 10 covered by the outer case. A back surface wall 20B of an outer case, the back surface wall being located on a back surface side of a mold exclusion part, is made from a resin that exhibits a higher degree of fluidity than a resin constituting the rest part of the outer case, and thereby, the outer case is multicolor molded using a plurality of resins exhibiting different degrees of fluidity.</p> |
