RESIN COMPOSITION FOR TEMPORARY FIXING, RESIN FILM FOR TEMPORARY FIXING, AND RESIN FILM SHEET FOR TEMPORARY FIXING

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for temporary fixing that has an excellent low-temperature adhesion property and a sufficient heat resistance, that can sufficiently fix a semiconductor wafer to a supporting body, and that can form a film-like temporary fixing material that enables the processed semiconductor wafer to be separated from the supporting body and a temporary fixing material with ease.SOLUTION: A resin film sheet 1 for temporary fixing comprises: a supporting film 10 with a thickness of 3-250μm subjected to release treatment by a silicon-based compound, a fluorinated compound, and the like; a resin film 20 for temporary fixing configured by a resin layer with a thickness of 5-300μm provided on the supporting film; and a protection film 30 with a thickness of 1-250μm provided on an opposite side to the supporting film 10 of the film 20 for temporarily fixing, and subjected to release treatment.