METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device .SOLUTION: A semiconductor chip 3 is transported onto a chip mounting region 2p1 of a wiring board 20 by a bonding jig 30, and the semiconductor chip 3 and the wiring board 20 are electrically connected as they are. The bonding jig 30 for mounting the semiconductor chip 3 on the wiring board 20, comprises: a holding part 30HD for suction-holding a logic chip LC; a pressing part 30PR for pressing against a rear face 3b of the semiconductor chip 3; and a sealing part 30SL for tightly adhering to a peripheral edge part of the rear face 3b of the semiconductor chip 3. In addition, a surface 30b that is an adhesion face with the rear face 3b of the semiconductor chip 3, of the sealing part 30SL, is formed of a resin.