| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cleaning method of a substrate holding member capable of suppressing remaining of metal fouling generated when processing the substrate holding member, and adhering onto the substrate holding member.SOLUTION: A cleaning method includes a pre-cleaning step for cleaning the surface of an electrostatic chuck 10 for holding a substrate W, and a voltage application step for applying a DC voltage to the substrate W and the electrostatic chuck 10 so that the electrostatic chuck 10 has a higher potential than the substrate W, while allowing the electrostatic chuck 10 to adsorb the substrate W.</p> |
