| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor package which includes a connection interface suitable for a signal to be treated to reduce a transmission loss of the signal and maintains sufficient radiation performance, and which is small sized and light weighted and easily manufactured.SOLUTION: In a semiconductor package, by using an input side of a transmission path of an input/output signal, which is connected to a package as a microstrip line and an output side as a waveguide, unnecessary transmission path conversion is skipped thereby to suppress a signal loss. In addition, by mounting a semiconductor device 13 stored in the package on a top face of a chip mount metal plate 11 which is composed of metal having good thermal conductivity, a stable radiation path to a waveguide interface metal plate 11 below the chip mount metal plate 12 is ensured. Further, by using a resin such as plastic as a material of a back-short incorporated lid body 16 to achieve light weight and facilitate manufacturing by a mold. And by providing metal coating on an internal surface 16b of the back-short incorporated lid body 16, the internal surface 16b is shaped into a smooth flat plane with less surface roughness thereby to reduce a signal loss. |
