| 摘要 |
PROBLEM TO BE SOLVED: To suppress that a position of connection of an electronic component deviates from a connection part of a connection member when a substrate on which the electronic component is mounted is arranged at a predetermined position to the connection member.SOLUTION: An electronic component 10 has: paired projections 16 which engage to each other at a position between a notch 21b and a projection 22a of a substrate 20; and paired first projections 14 and paired second projections 15 which contact a rear surface of the substrate 20. Then, a position of the substrate 20 in a surface direction in the electronic component 10 is regulated by a fact that the paired projections 16 engage to each other between the notch 21b and the projection 22a, and a position of the substrate 20 in a thickness direction in the electronic component 10 is regulated by a fact that the paired first projections 14 and the paired second projections 15 contact the rear surface of the substrate 20. Thus, when the respective electrodes 12 are soldered to the substrate 20 by reflow, movement of the electrodes 12 by surface tension of solder which is generated by soldering by the reflow is suppressed. |
