ADHESIVE TAPE FOR ELECTRONIC COMPONENTS

摘要

The present invention relates to a semiconductor package protecting adhesive tape including a heat resistant base material and an adhesive layer produced by coating an adhesive composition on the heat resistant base material. The adhesive composition includes a phenoxy resin, an energy concentration hardening acrylic resin, and a thiol-based adhesive modifier. The adhesive layer is hardened through thermal hardening and energy concentration. An adhesive tape for an electronic component according to the present invention has excellent stickness and adhesion with a lead frame, so that there is no sealing resin bleed-out or flash. Hardness is adjusted, so that a temperature at which adhesion is expressed to a lead frame can be adjusted. Moreover, through a thiol-based additive, excellent adhesion even with a PPF lead frame and an NiPdAu lead frame having lower adhesion compared to an existing AgCu lead frame can be ensured. Excellent cohesive strength can solve an adhesive remaining problem in which an adhesive remains on a surface of a lead frame or a sealing resin after de-taping.