发明名称 SILICON WAFER HAVING COLORED TOP SIDE
摘要 A silicon wafer having colored top side is disclosed in the present invention. The silicon wafer includes: a wafer; a first semi-conductor layer, formed on at least a portion of a top side of the wafer, having periodical structures to form a grating pattern, and a second semi-conductor layer, formed on the first semi-conductor layer with a bottom side substantially fully contacted with the periodical structures. The first semi-conductor layer and the second semi-conductor layer form a photonic crystal layer and work to reflect a predetermined wavelength range of incident visible light beams. The present invention provides a silicon wafer which can reflect specified color(s) from the surface facing external light beams. Therefore, dies from cutting the silicon wafer with functions to interact with external environment rather than packaged can have advantages to show some specified logo or trademark.
申请公布号 US2015185378(A1) 申请公布日期 2015.07.02
申请号 US201314141717 申请日期 2013.12.27
申请人 SunASIC Technologies, Inc. 发明人 LIN Chi-Chou;HE Zheng-Ping
分类号 G02B5/18;G02B1/02 主分类号 G02B5/18
代理机构 代理人
主权项 1. A silicon wafer having colored top side, comprising: a wafer; a first semi-conductor layer, formed on at least a portion of a top side of the wafer, having periodical structures to form a grating pattern, and a second semi-conductor layer, formed on the first semi-conductor layer with a bottom side substantially fully contacted with the periodical structures, wherein the first semi-conductor layer and the second semi-conductor layer form a photonic crystal layer and work to reflect a predetermined wavelength range of incident visible light beams so that at least two different colors can be provided from the top of the wafer.
地址 New Taipei City TW