发明名称 METHOD AND DEVICE FOR TESTING ELECTRICAL PROPERTIES OF ELECTRICALLY-CONDUCTIVE VIA OF PCB
摘要 <p>A method for testing electrical properties of electrically-conductive vias of a PCB, comprising the following steps: preparing a PCB to be tested of electrical properties of vias, using a lead to electrically connect sequentially two ends of to-be-tested electrically-conductive vias on the PCB, where the electrically-conductive vias are connected in series to form an electrically-conductive circuit; employing a testing instrument to test a conductive property of the electrically-conductive circuit, and determining whether or not the electrically-conductive vias on the electrically-conductive circuit are conducted. The lead is used to connect in series the to-be-tested electrically-conductive vias to form one circuit. The testing instrument is used to test the conductivity property of the circuit. When the test result of the testing instrument is conducting, then it means that all of the electrically-conductive vias on the tested circuit are conductive; when the test result of the testing instrument is non-conducting, then it means that cases of non-conductive electrically-conductive vias are found on the tested circuit. The method is high in test efficiency and saves manpower and resources.</p>
申请公布号 WO2015096666(A1) 申请公布日期 2015.07.02
申请号 WO2014CN94349 申请日期 2014.12.19
申请人 GUANGZHOU FASTPRINT CIRCUIT TECH CO., LTD.;SHENZHEN FASTPRINT CIRCUIT TECH CO.,LTD.;YIXING SILICON VALLEY ELECTRONICS TECHNOLOGY CO.,LTD. 发明人 LIU, YANG;LIU, PAN;ZENG, ZHIJUN
分类号 G01R31/02 主分类号 G01R31/02
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