Method For Treating A Leadframe Surface And Device Having A Treated Leadframe Surface

摘要

A method for manufacturing an integrated circuit device is disclosed. A leadframe is provided having a die support area configured to receive an integrated circuit die and a plurality of leadframe fingers adjacent the die support area, each leadframe finger including a finger tip area at one end of the leadframe finger. The leadframe is masked such that one or more areas of the leadframe are covered and one or more areas of the leadframe are exposed, wherein for each leadframe finger, a first region of the respective finger tip area is covered by the masking and a second region of the respective finger tip area is exposed. The one or more exposed areas of the leadframe are silver plated such for each leadframe finger, the second region of the respective finger tip area is sliver plated and the first region of the respective finger tip area is not sliver plated.

主权项

1. A method for manufacturing an integrated circuit device, the method comprising:
providing a leadframe comprising:
a die support area configured to receive an integrated circuit die; anda plurality of leadframe fingers adjacent the die support area, each leadframe finger including a finger tip area at one end of the leadframe finger; masking the leadframe such that one or more areas of the leadframe are covered and one or more areas of the leadframe are exposed, wherein for each leadframe finger, a first region of the respective finger tip area is covered by the masking and a second region of the respective finger tip area is exposed; and silver plating the one or more exposed areas of the leadframe, such for each leadframe finger, the second region of the respective finger tip area is sliver plated and the first region of the respective finger tip area is not sliver plated.