| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit device capable of preventing solder dripping while minimizing a contact area between a terminal and a substrate.SOLUTION: In a circuit device 1 formed by inserting a terminal 10 into a hole 4 formed on a substrate 2 and bonding the terminal 10 by a solder, the terminal 10 has an insertion part 11 which is located inside the hole 4 and a projection 12 located outside the hole 4 and projects along the substrate. In a state where the terminal 10 is inserted in the hole 4, the projection 12 is located on a surface side of the substrate 2 toward which an element 5 is moved when the element 5 is to be attached and located at a position away from the surface. In addition, on each of both surfaces of the substrate 2, a land 3 is exposed on an edge of the hole 4 and a solder fillet F is formed between the land 3 and the terminal 10.</p> |
