LEAD FRAME, SUBSTRATE FOR LED PACKAGE, REFLECTOR MEMBER, LED PACKAGE, LIGHT EMITTING DEVICE, LIGHT EMITTING SYSTEM, METHOD FOR MANUFACTURING SUBSTRATE FOR LED PACKAGE, AND METHOD FOR MANUFACTURING LED PACKAGE

摘要

Provided are: an LED package that can be easily used by providing an external connection terminal of the LED package on the upper surface side (LED chip mounting surface side) of the LED package; and a member or the like to be used for the LED package. This lead frame has: a die pad for mounting an LED chip; a first electrode section for electrically connecting to a first electrode of the LED chip; and a second electrode section for electrically connecting to a second electrode of the LED chip. The first electrode section has a first external connecting terminal that is bent to be exposed from a resin main surface on the LED chip mounting side, said resin constituting the LED package, and the second electrode section has a second external connecting terminal that is bent to be exposed from the resin main surface on the LED chip mounting side.