| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can inhibit the occurrence of warpage.SOLUTION: A wiring board 10 has a wiring structure 11 which includes: a core substrate 20; an insulation layer 41 which is laminated on a top face 20A of the core substrate 20 and composed of an insulating resin with a reinforcement material; an insulation layer 31 which is laminated on an undersurface 20B of the core substrate 20 and composed of an insulating resin with a reinforcement material; and via wiring 42 formed in the insulation layer 41. The wiring board 10 has: insulation layers 51, 53, 55 and wiring layers 52, 54, 56, which consist chiefly of a photosensitive resin; a wiring structure 12 laminated on a top face 41A of the insulation layer 41; and a solder resist layer 13 which is laminated on an undersurface of the insulation layer 31 and consist chiefly of a photosensitive resin. A wiring density of the wiring structure 12 is higher than a wiring density of the wiring structure 11. The wiring board further includes glass cloths 41G which are provided in the insulation layer 41 and exposed on a top face 41A of the insulation layer 41. |
