SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

摘要

In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

主权项

1. A semiconductor package comprising:
a housing having a first side; a second side opposite the first side; a third side extending at an angle from the first side toward the second side; an interior portion configured for housing a semiconductor device formed on a semiconductor substrate; a first projection portion of the first side extending from the first side a first distance past the third side; a second projection portion of the second side extending from the second side a second distance past the third side; and a first attachment clip having a first end attached to the first projection portion and a second end attached to the second projection portion and having a main portion that extends between the first and second ends.