| 发明名称 |
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board includes: a flexible substrate having a flexible region and a plurality of rigid regions; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers. |
| 申请公布号 |
US2015189735(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414249124 |
申请日期 |
2014.04.09 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Yu Kyung Chul;Kim Ha II;Kim Young Man;An Dong Gi |
| 分类号 |
H05K1/02;H05K1/03;H05K3/10 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A rigid flexible printed circuit board comprising:
a flexible substrate having a flexible region and a plurality of rigid regions; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers. |
| 地址 |
Suwon-Si KR |
