| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a jig capable of causing a probe to accuracy contact a pad formed on a substrate regardless of outer shape tolerance of the substrate.SOLUTION: Jigs (100-300) comprise: first members (1, 13) on which semiconductor chips (6-8) are mounted, the semiconductor chips having dents (10, 11) for mounting a substrate (63) including thereon pads (61, 81) electrically connected to the semiconductor chips; second members (2, 30) provided on the first members; first fixing members (3, 32) for fixing the second members to the first members; and first probes (4, 12) supported by the second members and supplying a voltage from an external device (9) to the pads. The plurality of first probes are aligned in one direction for one corresponding pad, a distance between the plurality of first probes provided for the one pad is shorter than a length of a side along the alignment direction of the first probes for the corresponding pad.</p> |
