Staggered Via Redistribution Layer (RDL) for a Package

摘要

An embodiment staggered via redistribution layer (RDL) for a package includes a first polymer layer supported by a metal via. The first polymer layer has a first polymer via. A first redistribution layer is disposed on the first polymer layer and within the first polymer via. The first redistribution layer is electrically coupled to the metal via. A second polymer layer is disposed on the first redistribution layer. The second polymer layer has a second polymer via laterally offset from the first polymer via. A second redistribution layer is disposed on the second polymer layer and within the second polymer via. The second redistribution layer is electrically coupled to the first redistribution layer.

主权项

1. A staggered via redistribution layer (RDL) for a package, comprising:
a first polymer layer disposed over a metal via, the first polymer layer having a plurality of first polymer vias; a first redistribution line disposed on the first polymer layer and within the plurality of first polymer vias, the first redistribution line contacting a top surface of the metal via within the plurality of first polymer vias; a second polymer layer disposed on the first redistribution line, the second polymer layer having a plurality of second polymer vias, wherein each of the plurality of second polymer vias is laterally offset from the plurality of first polymer vias, wherein the plurality of second polymer vias is laterally above the metal via; and a second redistribution line disposed on the second polymer layer and within the plurality of second polymer vias, the second redistribution line electrically coupled to the first redistribution line.