METHOD USING GLASS SUBSTRATE ANODIC BONDING

摘要

A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

主权项

1. A method of forming a substrate pair assembly, comprising:
providing a first optically transparent substrate and a second optically transparent substrate; depositing a first layer of metal material on the first optically transparent substrate; forming a first layer of metal oxide material wherein the metal oxide is the oxidation product of the metal material and the first optically transparent substrate, and is formed during the depositing of the metal material; patterning the first layer of the metal material to create a metal feature; and forming a second layer of metal oxide material, wherein the second layer of metal oxide is the oxidation product of the metal material and the second optically transparent substrate; and is disposed between the second optically transparent substrate and the metal feature, wherein the layer of metal material and the first and second layers of metal oxide form a first anodic bond between the first optically transparent substrate and the second optically transparent substrate.