发明名称 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
摘要 <p>The present invention relates to a method for manufacturing a flexible printed circuit board. Provided is the method for manufacturing the flexible printed circuit board capable of improving production costs and improving the accuracy of the outline dimension of the substrate. The method for manufacturing the flexible printed circuit board includes the steps of: (a) dividing an aluminum sheet into a rigid region and a flexible region for forming the flexible printed circuit board; (b) forming a through hole on the flexible region; (c) coating one side of the aluminum sheet except the flexible region with an adhesive; (d) forming a metal copper foil laminate plate by successively laminating and hot-pressing an insulation layer and a copper foil on the adhesive; (e) forming a circuit pattern on the metal copper foil laminate plate; and (f) cutting and processing the circuit pattern on the metal copper foil laminate plate.</p>
申请公布号 KR101533013(B1) 申请公布日期 2015.07.02
申请号 KR20140070842 申请日期 2014.06.11
申请人 SEJONG MATERIALS CO., LTD. 发明人 SUNG, JAE DEOK
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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