| 摘要 |
PROBLEM TO BE SOLVED: To prevent a dividing position from being deviated or an element end portion from being chipped during braking in laser dicing.SOLUTION: A modification part 17 is formed along a predetermined dividing line L within a sapphire substrate 10 by laser irradiation, and the sapphire substrate 10 is then divided by pressing a pressing blade 18 along the predetermined dividing line L and applying force, such that the sapphire substrate 10 is separated for each light-emitting element. At such a time, the force is applied while pressing the pressing blade 18 at a position of a predetermined deviation amount &Dgr;x1 from the predetermined dividing line L. The deviation amount &Dgr;x1 is such a value that the distribution of a stress received from the pressing blade 18 to the substrate 10 becomes symmetric with the predetermined dividing line L interposed therebetween. |
