CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE SEALING MATERIAL, ORGANOPOLYSILOXANE CURED PRODUCT OBTAINED BY CURING THE COMPOSITION, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE SEALED BY USING THE CURED PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide a curable organopolysiloxane composition which allows formation of an optical member that can suppress generation of cracks or peeling and can give high extraction efficiency of light and a high luminance retention rate even when an LED light-emitting device is used for a long period of time, and to provide a semiconductor light-emitting device and an illumination or image display device using the superior characteristics of the composition.SOLUTION: A curable organopolysiloxane composition for a semiconductor light-emitting device sealing material is provided, which comprises (A) an organopolysiloxane having two or more silanol groups in one molecule, and with respect to 100 parts by weight of (A), 50 to 100 parts by weight of (B) spherical silicone resin particles, 0.1 to 30 parts by weight of (C) fumed silica, 1 to 10000 ppm by weight of (D) a curing catalyst, and 3 to 30 parts by weight of (G) silicone oil having a carbinol-modified terminal.