METHOD FOR ELECTROPLATING THE BOARD USING THE ELECTROPLATING APPARATUS

摘要

An objective of the present invention is to provide a substrate electroplating method using an electroplating device capable of preventing a withstanding voltage and a short-circuit phenomenon due to a lead-in wire as raw materials do not need the lead-in wire for a power supply by directly supplying power required to electroplate to a conductive layer using an electroplating device when a circuit is electroplated to manufacture a substrate. An other objective of the present invention is to provide a substrate electroplating method using an electroplating device capable of performing an electroplating process and reduce manufacturing costs by easily mounting raw materials as an electroplating device is conducted to supply power, and to fixate raw materials and a part to be electroplated by turning a coupler of the electroplating device by hand. The substrate electroplating method comprises: a first step of penetrating a CNC hole (14) on raw materials (FR-4) (10) for a substrate; a second step of forming a circuit (11a) on a conductive layer (11) of the raw materials (10); a third step of spreading PSR ink (20) to the rest of the circuit (11a) except a part to be electroplated with silver; and a fourth step of arranging several raw materials (10) performing the first to third steps into a line in the substrate electroplating device, and electroplating a part of the circuit (11a) where the PSC ink (20) is not spread by placing the substrate electroplating device to a plating bath.