发明名称 TOUCH PANEL MANUFACTURING METHOD
摘要 <p>The present invention provides a touch panel manufacturing method whereby, when forming bridge circuits by printing, it is possible to reduce contact resistance between conductive elements and the bridge circuits. A conductive film is formed upon a substrate, and first conductive parts and second conductive elements (120a) are formed. The first conductive parts are integrally formed from a plurality of first conductive elements which are positioned along a first direction of the substrate, and first bridge circuit parts which form connections between the first conductive elements. The second conductive elements are positioned in a second direction to be isolated from one another with the first bridge circuit parts therebetween. Insulator films (15) are formed to span the gap between the second conductive elements, and second bridge circuit parts (121b) which form connections between the second conductive elements are printed upon the insulator films. A hydrophilization process is carried out upon at least the parts of the second conductive elements where the second bridge circuit parts are formed. The second bridge circuit parts upon the printed second conductive elements expand in response to the hydrophilicity of the second conductive elements, and the contact resistance between the second conductive elements and the second bridge circuit parts is reduced.</p>
申请公布号 WO2015098608(A1) 申请公布日期 2015.07.02
申请号 WO2014JP83206 申请日期 2014.12.16
申请人 SHARP KABUSHIKI KAISHA 发明人 NAKAGAWA TOSHIAKI;NOMA MIKIHIRO
分类号 G06F3/044 主分类号 G06F3/044
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