| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulation sheet having sufficient durability under a heating and humidification condition by preventing moisture from permeating into an encapsulation body from a bonding interface when producing the encapsulation body, an encapsulation body having sufficient durability under a heating and humidification condition, and device.SOLUTION: An encapsulation body 20 is so configured that a substrate 31 and an object 32 to be encapsulated and a supporting base material 11 disposed on the substrate 31 are encapsulated through an encapsulating agent layer 12. In the encapsulation body 20 formed in this way, since arithmetic average roughness Ra of a surface 12a of the encapsulating agent layer 12 is less than 40 mm and a maximum protrusion height Rp is controlled to be less than 500 nm, sealing performance at interfaces between the encapsulating agent layer 12 and the substrate 31 or the object 32 to be encapsulated is improved, permeation of moisture from the bonding interface to an inside of the encapsulation body 120 is prevented, which makes durability under a heating and humidification condition sufficient. |
