发明名称 |
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A method for manufacturing an acoustic wave device includes: forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light, a piezoelectric substrate being joined to an upper surface of the supporting substrate; forming a groove on an upper surface of the piezoelectric substrate so as to overlap with the altered domain; and cutting the supporting substrate at the groove. |
申请公布号 |
US2015188507(A1) |
申请公布日期 |
2015.07.02 |
申请号 |
US201414581330 |
申请日期 |
2014.12.23 |
申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
SHIMIZU Yohei |
分类号 |
H03H3/02;B26F3/00;B23K26/00;H03H9/25 |
主分类号 |
H03H3/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing an acoustic wave device, comprising:
forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light, a piezoelectric substrate being joined to an upper surface of the supporting substrate; forming a groove on an upper surface of the piezoelectric substrate so as to overlap with the altered domain; and cutting the supporting substrate at the groove. |
地址 |
Tokyo JP |