| 摘要 |
一种用于制造具有一个功能层之复合体(36)或进一步用于制造电子或光电元件(40,42,44)的制程。层结构复合体(36)包含一个基板(34)，以及至少一个多晶或至少一个单晶层(38)，包含至少一个化合物半导体、一陶瓷材料或一金属硬质材料。该制程包含步骤：加热该平坦基板表面达温度100℃及550℃；藉由氢和电浆清洁该基板；藉由施加碳、氮或氧和电浆终止该基板表面；以及藉由在该基板上供应来自至少一材料源(20,22)之材料成分而成长至少一层(38)。使用根据所揭示制程所制造的复合体(36)用于制造电子或光电元件。 A process for producing a composite body (36) having a functional layer or for further use for producing an electronic or optoelectronic component (40, 42, 44). The layer-structured composite body (36) comprises a substrate (34) and at least one polycrystalline or at least one single-crystalline layer (38), comprising at least one compound semiconductor, a ceramic material or a metallic hard material. The process includes steps of: heating the planar substrate surface to a temperature between 100℃ and 550℃; cleaning the substrate by hydrogen and a plasma; terminating the substrate surface by applying carbon, nitrogen or oxygen and a plasma; and growing the at least one layer (38) by supplying material components from at least one material source (20, 22) to the substrate. Use of the composite body (36) produced in accordance with the disclosed process for producing an electronic or optoelectronic component. |
