发明名称 电解蚀刻方法以及电解蚀刻液;ELECTROLYTIC ETCHING METHOD AND ELECTROLYTIC ETCHING SOLUTION
摘要 本发明之课题系提供一种在保持由卑金属材料所成之被处理材之形状的状态下,可自被处理材料之表面仅选择性蚀刻含有贵金属之金属被膜之电解蚀刻方法及电解蚀刻液。;本发明提供一种电解蚀刻方法,其系用于解决上述课题之电解蚀刻方法,其特征系将前述被处理材浸渍于包含以下述式(1)表示之错化剂1g/L~100g/L,pH调整为2~7之电解蚀刻液中,且以该被处理材作为阳极,在与其他电极之间施加电压,边蚀刻该含有贵金属之金属被膜,边于该基材之表面上形成阳极氧化被膜。;惟,上述式(1)中,1≦n≦7,X为胺基或硫醇基。;The present invention provides an electrolytic etching method, which solve the above-mentioned problems of electrolytic etching method. The method characterized in that the processed material is immersed in a complex agent of 1g/L~100g/L containing the following formula (1), and electrolytic etching solution with pH adjusted to 2 to 7. The processed material is used as an anode, and applying voltage to the other electrodes so as to etch the metal film containing noble metal as well as form anodic oxidation film on the surface of the substrate.;In formula (1), 1≦n≦7, X is amino group or thiol group.
申请公布号 TW201525201 申请公布日期 2015.07.01
申请号 TW103142993 申请日期 2014.12.10
申请人 学校法人关东学院 KANTO GAKUIN SCHOOL CORPORATION 发明人 克多尼尔 克里斯多福 CORDONIER, CHRISTOPHER;本间英夫 HONMA, HIDEO
分类号 C25F5/00(2006.01) 主分类号 C25F5/00(2006.01)
代理机构 代理人 陈豫宛
主权项
地址 日本 JP