| 摘要 |
<p>A template material layer having a periodic profile is formed on a flexible printed circuit board substrate whilst the substrate is maintained in a stress free state. Conformal thin film circuit board layers are subsequently deposited over the template material. The template material may a sacrificial material removable by etching or sublimation to form cavities between the thin film circuit board layers and the flexible substrate. Alternatively the template material may be retained. Electronic devices mounted on the thin film layers are subjected to reduced stress when the flexible circuit is stretched or bent when in use. The flexible printed circuit can be used where repeated stretching or bending is required in, for example, textile and folding display screen applications</p> |
