| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet with excellent thermal conductivity, insulation property, reflow resistance, and adhesion with an adherend and used for bonding a heat generation component in an electronic device with a heat discharging component such as a heat sink and a radiator plate, for electronic devices. <P>SOLUTION: An adhesive composition for electronic devices comprises: (a) a thermoplastic resin; (b) an epoxy resin; (c) a curing agent, (d) boron nitride particles; and (e) inorganic spherical particles. An average primary particle diameter of the inorganic spherical particles (e) is 10 vol% particle diameter or less of a primary particle diameter distribution on a volume basis of the boron nitride particles (d). <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
