| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connecting material having excellent wettability and connectivity, a method for manufacturing the same, and semiconductor equipment using the same. <P>SOLUTION: The connecting material 100 is constituted of a member including Zn 101, and a plurality of metal layers 102, 103 layered around the Zn 101, and≥80% of the surface area of the outermost surface area of the member is covered with a metal M (Au, Ag, Cu, Ni, Pt, Pd) 103. After the melting of the connection material 100, the connecting material has a composition composed of, by weight,≥2% and≤9% Al 102, >0% and≤10% metal M 103, and the balance Zn 101. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
