| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a paste for forming a solder ground layer capable of forming a solder ground layer having a flat surface by applying the paste onto a circuit and firing the paste when solder joining an electronic component such as a semiconductor element onto the circuit. <P>SOLUTION: The paste for forming a solder ground layer used when an electronic component is solder joined onto a circuit contains at least a metal powder and a resin. When the distortion amount is measured in a state where stress is not applied after applying a shear stress for 1 min with a shear rate of 10 s<SP POS="POST">-1</SP>, the distortion amount 2 min after releasing the shear goes below -40%, assuming the distortion amount is 0 at a moment in time when the shear stress is released. <P>COPYRIGHT: (C)2012,JPO&INPIT |
