| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hot dip metal plating method and a hot dip metal plating apparatus which, in a hot dip metal plating line using a gas wiping process, suppress the sticking of plating metal droplets to a strip after wiping, and further require no complicated maintenance work concerning production equipment. <P>SOLUTION: When hot dip metal plating is performed using a gas wiping process in which a strip is continuously pulled out from the inside of a plating metal bath, and surplus plating metal stuck to the strip face is squeezed off by gas jetted from wiping nozzles toward the strip face to control the coating weight of the plating metal, support rolls on the bath vertically supporting the strip is arranged at the upper parts of the wiping nozzles, shielding nets are provided from the arranged positions of the wiping nozzles in the upper part along the strip face to the arranged positions of the support rolls on the bath, and further, flow straightening plates are provided between the wiping nozzles and the bath face of the plating metal bath to prevent the sticking of plating metal droplets to the strip face upon hot dip metal plating. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
