发明名称 |
High frequency power amplifier |
摘要 |
A high frequency power amplifier includes an FET chip, a wire connected at a first end to the FET chip, an input-side matching circuit substrate, a resistive element on the input-side matching circuit substrate and connected in series with the FET chip, a transmission portion of a conductive material on the input-side matching circuit substrate, in contact with one end of the resistive element, and connected to an input electrode, a wire connection portion of a conductive material on the input-side matching circuit substrate, in contact with a second end of the resistive element, and connected to a second end of the wire, and a shorting portion of a conductive material having a smaller width than the resistive element and on the resistive element, connecting the transmission portion to the wire connection portion. |
申请公布号 |
US9071199(B2) |
申请公布日期 |
2015.06.30 |
申请号 |
US201314095446 |
申请日期 |
2013.12.03 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
Miwa Shinichi |
分类号 |
H03F3/191;H03F3/16;H03F3/24 |
主分类号 |
H03F3/191 |
代理机构 |
Leydig, Voit & Mayer, Ltd. |
代理人 |
Leydig, Voit & Mayer, Ltd. |
主权项 |
1. A high frequency power amplifier comprising:
an FET chip; a wire connected at a first end to said FET chip; an input-side matching circuit substrate; a resistive element located on said input-side matching circuit substrate and connected in series with said FET chip; and a conductive material located on said input-side matching circuit substrate, wherein said conductive material includes
a transmission portion in contact with a first end of said resistive element and connected to an input electrode,a wire connection portion in contact with a second end of said resistive element, and connected to a second end of said wire, anda shorting portion having a smaller width than said resistive element, located on said resistive element, and connecting said transmission portion of said conductive material to said wire connection portion of said conductive material. |
地址 |
Tokyo JP |