发明名称 |
Terminal lead |
摘要 |
A terminal lead 1 includes an inner end portion 1a to be arranged inwardly of an exterior casing 9 which accommodates an electrochemistry element 6, an outer end portion 1b to be arranged outwardly of the exterior casing 9, and a plate-shaped metallic substrate 2 as a base material. An insulating resin film 4 is arranged at a portion of the terminal lead 1 corresponding to a seal portion 9x of the exterior casing 9. In this terminal lead 1, a surface coating layer 3 is formed on both surfaces 2p and 2p of the metallic substrate 2 in a thickness direction thereof. A coated amount of both widthwise end portions 3a and 3a of the surface coating layer 3 formed on both surfaces 2p and 2p of the metallic substrate 2 in the thickness direction is less than that a widthwise intermediate portion 3b thereof. |
申请公布号 |
US9070938(B2) |
申请公布日期 |
2015.06.30 |
申请号 |
US201213723340 |
申请日期 |
2012.12.21 |
申请人 |
Showa Denko Packaging Co., Ltd. |
发明人 |
Hashimoto Daisuke;Watanabe Takurou;Yokoi Keiichi;Hata Hiroshi |
分类号 |
H01M2/30;H01G11/74;H01G11/76;H01M2/06 |
主分类号 |
H01M2/30 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A terminal lead comprising:
an inner end portion to be arranged inwardly of an exterior casing which accommodates an electrochemical element; an outer end portion to be arranged outwardly of the exterior casing; a plate-shaped metallic substrate as a base material; an insulating resin film to be arranged at a portion of the metallic substrate corresponding to a seal portion of the exterior casing; and a surface coating layer formed on both surfaces of the metallic substrate in a thickness direction of the metallic substrate; wherein a coated amount of both widthwise end portions of the surface coating layer formed on both the surfaces of the metallic substrate in the thickness direction is less than a coated amount of a widthwise intermediate portion of the surface coating layer formed on both the surfaces of the metallic substrate in the thickness direction. |
地址 |
Kanagawa JP |