发明名称 Terminal lead
摘要 A terminal lead 1 includes an inner end portion 1a to be arranged inwardly of an exterior casing 9 which accommodates an electrochemistry element 6, an outer end portion 1b to be arranged outwardly of the exterior casing 9, and a plate-shaped metallic substrate 2 as a base material. An insulating resin film 4 is arranged at a portion of the terminal lead 1 corresponding to a seal portion 9x of the exterior casing 9. In this terminal lead 1, a surface coating layer 3 is formed on both surfaces 2p and 2p of the metallic substrate 2 in a thickness direction thereof. A coated amount of both widthwise end portions 3a and 3a of the surface coating layer 3 formed on both surfaces 2p and 2p of the metallic substrate 2 in the thickness direction is less than that a widthwise intermediate portion 3b thereof.
申请公布号 US9070938(B2) 申请公布日期 2015.06.30
申请号 US201213723340 申请日期 2012.12.21
申请人 Showa Denko Packaging Co., Ltd. 发明人 Hashimoto Daisuke;Watanabe Takurou;Yokoi Keiichi;Hata Hiroshi
分类号 H01M2/30;H01G11/74;H01G11/76;H01M2/06 主分类号 H01M2/30
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A terminal lead comprising: an inner end portion to be arranged inwardly of an exterior casing which accommodates an electrochemical element; an outer end portion to be arranged outwardly of the exterior casing; a plate-shaped metallic substrate as a base material; an insulating resin film to be arranged at a portion of the metallic substrate corresponding to a seal portion of the exterior casing; and a surface coating layer formed on both surfaces of the metallic substrate in a thickness direction of the metallic substrate; wherein a coated amount of both widthwise end portions of the surface coating layer formed on both the surfaces of the metallic substrate in the thickness direction is less than a coated amount of a widthwise intermediate portion of the surface coating layer formed on both the surfaces of the metallic substrate in the thickness direction.
地址 Kanagawa JP
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