Methods and apparatus for cleaning semiconductor wafers

摘要

An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.

主权项

1. An apparatus for cleaning a wafer having at least one surface comprising:
a chuck for holding the wafer, the chuck being rotated by a first driving mechanism; a plate positioned adjacent to the wafer defining a gap therebetween, wherein said plate has a surface and the apparatus is configured to translate the plate across the surface of the wafer in a direction parallel to the surface of the wafer; a mechanical wave transducer attached to said plate causing said plate to vibrate, said mechanical wave transducer being a mega sonic transducer; and a second driving mechanism configured to rotate said plate and said transducer attached to said plate while maintaining the gap between the plate and the wafer, wherein the second driving mechanism is configured to rotate the plate and the transducer around an axis vertical to said plate such that the following condition is satisfied: a distance d between point A and point O must be smaller than the radius of said plate in the time that the plate rotates π radian, wherein point A is a point on the wafer that overlays with the leading edge of said plate in the direction of plate movement and point O is the center of said plate.