Packaging mechanisms for dies with different sizes of connectors

摘要

Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost.

主权项

1. A method of forming a semiconductor die package, comprising:
bonding a first packaged die to an interconnect substrate using ones of a plurality of bonding structures; bonding a second packaged die to the interconnect substrate using other ones of the plurality of bonding structures; performing an electrical test on a plurality of test structures, wherein the plurality of test structures include a plurality of probing pads electrically connected to one or more of the plurality of bonding structures by metal lines, at least two of the probing pads being connected together by the metal lines in series with at least two of the plurality of bonding structures; and severing the metal lines to terminate electrical connection between the plurality of probing pads and the bonding structures.