发明名称 Printed chemical mechanical polishing pad
摘要 A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
申请公布号 US9067299(B2) 申请公布日期 2015.06.30
申请号 US201213591051 申请日期 2012.08.21
申请人 Applied Materials, Inc. 发明人 Bajaj Rajeev;Chin Barry Lee;Lee Terrance Y.
分类号 B29C67/00;B24B37/26;B24D18/00 主分类号 B29C67/00
代理机构 Fish & Richardson P.C. 代理人 Fish & Richardson P.C.
主权项 1. A method of fabricating a polishing layer of a polishing pad, comprising: successively depositing a plurality of layers with a 3D printer, each layer of the plurality of layers deposited by spreading a layer of powder across an underlying layer of the plurality of layers, the layer of powder including a powdered material and abrasive particles,ejecting droplets of a binder material from a nozzle onto the layer of powder, the powdered material and binder material providing a pad material precursor, andsolidifying the pad material precursor to form a solidified pad material having a matrix of bonded material formed from the powdered material and the binder material, and the abrasive particles held in the matrix.
地址 Santa Clara CA US