| 发明名称 | Package for an optoelectronic semiconductor component and semiconductor component | ||
| 摘要 | A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed. | ||
| 申请公布号 | US9070853(B2) | 申请公布日期 | 2015.06.30 |
| 申请号 | US201113825303 | 申请日期 | 2011.09.13 |
| 申请人 | OSRAM OPTO SEMICONDUCTORS GMBH | 发明人 | Moellmer Frank;Arzberger Markus;Schwind Michael;Hoefer Thomas |
| 分类号 | H01L23/495;H01L33/62;H01L33/48;H01S5/022;H01L33/64;H01S5/024 | 主分类号 | H01L23/495 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A package for an optoelectronic semiconductor component, the package comprising: a package body; a first connecting lead; and a second connecting lead, the first connecting lead and the second connecting lead each extending in a vertical direction through the package body, wherein the first connecting lead has a cross-section of at least 1 mm2 in a plane running perpendicular to the vertical direction; and wherein the cross-section of the first connecting lead is larger than the second connecting lead at each point along the vertical direction. | ||
| 地址 | Regensburg DE | ||