| 发明名称 | Light-emitting diode manufacturing method | ||
| 摘要 | A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an LED chip on the substrate; combining the flexible material layer and the hard material layer together wherein the LED chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively. | ||
| 申请公布号 | US9070842(B2) | 申请公布日期 | 2015.06.30 |
| 申请号 | US201314035943 | 申请日期 | 2013.09.24 |
| 申请人 | Zhongshan Innocloud Intellectual Property Services Co., Ltd. | 发明人 | Chen Pin-Chuan;Chen Lung-Hsin |
| 分类号 | H01L21/00;H01L33/50;H01L33/60 | 主分类号 | H01L21/00 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A light-emitting diode manufacturing method, comprising the steps of: providing a flexible layer, wherein the flexible material layer comprises a flexible reflective layer and phosphor glue; providing a hard material layer, wherein the hard material layer comprises a substrate and at least one chip set on the substrate; combining the flexible material layer an the hard material layer, wherein the at least one chip is brought to insert into the phosphor glue, the flexible reflective layer is extruded to connect with the substrate; and solidifying the flexible reflective layer and the phosphor glue to form at least one reflective cup surrounding the at least one chip and a phosphor layer receiving the at least one chip therein. | ||
| 地址 | Zhongshan CN | ||