Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug

摘要

A thermal transfer component, a thermal transfer apparatus and a method for cooling a heat generating component located upon a substrate each include a thermally conductive frame having an aperture formed completely through the thermally conductive frame within which aperture is located a thermally conductive plug. The thermally conductive plug aligns with and contacts the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. A spring may further compress the thermally conductive plug against the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. The thermally conductive plug comprises an isotropic thermal transfer material and the thermally conductive frame comprises an anisotropic thermal conductive material to provide for enhanced thermal transfer from the heat generating component to a chassis.

主权项

1. A thermal transfer component comprising:
a thermally conductive frame sized to fit a substrate, the thermally conductive frame including an aperture completely through the thermally conductive frame at a location of a heat generating component located upon the substrate when the thermally conductive frame and the substrate are mutually aligned and assembled; a tapered thermally conductive plug comprising a first side and a second side located in the aperture, the first side having a smaller surface area than a second side wherein the first and second sides are parallel, the second side contacting contacting the heat generating component to provide a thermal connection between the thermally conductive frame and the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled; and a planar-shaped spring contacting at least a portion of said first side of said thermally conductive plug.