| 摘要 |
<p>The present invention aims to provide a method for manufacturing a wiring circuit board having a jumper which can be formed to have a fine line width by using an inkjet method or the like. The wiring circuit board is manufactured by: preparing a circuit board wherein multiple first electrodes (10), which are placed apart from each other in the direction of an X axis and are connected with each other by a connection part (15), and multiple second electrodes (20), which are placed apart from each other in the direction of a Y axis interposing the connection part (15) there between, are formed; forming an insulation film (30), which covers an area, including end portions of the second electrodes (20), and the connection part (15), in the direction of the Y axis between adjacent second electrodes (20); forming a pair of guide parts (31a, 31b), which are extended in parallel along an extension line in the direction of the Y axis of the insulation film (30) with a gap (32) narrower than the width of the insulation film (30), on the second electrodes (20); and forming the jumper (40) including a conductive film, which connects adjacent second electrodes (20) with each other, by applying a liquid conductive member on the insulation film (30) and in the gap (32) of the guide parts (31a, 31b) in the direction of the Y axis.</p> |
