MANUFACTURING APPARATUS FOR LED PACKAGE HAVING BASETRAY HAVING ELASTIC CONTAIN GROOVE, FLUORESCENCE LAYER MANUFACTURING METHOD AND LED PACKAGE MANUFACTURING METHOD USING THE SAME

摘要

The present invention relates to an apparatus for manufacturing a fluorescent layer for a light emitting diode package including a base tray with a receiving groove with elasticity, a method for manufacturing the fluorescent layer for the light emitting diode package using the same, and a method for manufacturing the light emitting diode package. The apparatus for manufacturing the fluorescent layer for the light emitting diode package according to the present invention includes the base tray on which one or more receiving grooves to receive fluorescent materials, wherein, at least part of the bottom of the receiving groove has the elasticity, and a pressing unit which pushes the fluorescent materials received in the receiving groove by pressing the part of the bottom of the receiving groove. The present invention remarkably increases the manufacturing yield of the light emitting diode package, reduces a failure rate, and reduces manufacturing costs.